Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.

江苏芯德半导体科技股份有限公司

Provides semiconductor assembly and testing solutions, including packaging design, customized packaging products (QFN, BGA, LGA, WLP, 2.5D/3D) and packaging testing services, with a Chiplet and advanced packaging integration platform; operates in China since 2020.

Filings

The documents are on HKEXnews; we link to the originals.

Matters the filing discloses

From the company’s latest filing; open a kind of matter to see how other companies disclosed it.

• Customer concentration
• Supplier concentration
• Overlapping customers and suppliers
• Raw material and commodity prices
• Capacity and utilisation
• Losses and path to profitability
• Working capital: receivables, prepayments and cash cycle
• Inventory level and ageing
• Goodwill, intangibles and asset impairment
• Preferred shares and fair-value liabilities
• Investments and fair-value assets
• Adverse change after the track record
• Non-IFRS measures and adjustments
• Non-recurring gains and losses
• Material share-based payments
• Sanctioned countries and export controls