Union Semiconductor (Hefei) Co., Ltd.

合肥新汇成微电子股份有限公司

Provides semiconductor packaging and testing services focused on DDICs, using bumping, CP, COG and COF technologies, serving LCD/AMOLED display customers in China. Fourth-largest DDIC advanced packaging and testing provider globally, second in the Chinese mainland, per Frost & Sullivan.

Filings

The documents are on HKEXnews; we link to the originals.

Matters the filing discloses

From the company’s latest filing; open a kind of matter to see how other companies disclosed it.

• Customer concentration
• Supplier concentration
• Overlapping customers and suppliers
• Raw material and commodity prices
• Pricing policy and price changes
• Capacity and utilisation
• Working capital: receivables, prepayments and cash cycle
• Inventory level and ageing
• Adverse change after the track record
• Non-IFRS measures and adjustments