Semiconductors: Hong Kong IPO applicants (64 companies)
64 Semiconductors companies that have filed to list in Hong Kong, newest first, with what each does and links to its filings.
- 2026-09-28
PHIPAnhui Sinomags Technology Co., Ltd安徽希磁科技股份有限公司Designs and manufactures magnetic sensors under an IDM model spanning chip design, wafer fabrication (in China and Germany) and module manufacturing, serving green energy, automotive, industrial automation, robotics and data center customers. Ranked tenth globally in magnetic sensor revenue in 2025 with 0.6% market share, per Frost & Sullivan.
- 2026-09-28
ProspectusFabless RISC-V chip designer in China offering chip, chipset and circuit board products with integrated software, serving 220 customers worldwide in human-machine interaction, multimedia processing, interconnectivity and computing. Largest domestic smart device human-machine interaction chip product provider by revenue in 2025, per Frost & Sullivan.
- 2026-09-21
ProspectusProvides manufacturing equipment and systems for the photovoltaic industry, including PV cell production automation equipment, complete production lines, and MES-based intelligent manufacturing systems, and, via subsidiary ficonTEC, assembly and testing equipment for silicon photonics devices globally.
- 2026-09-11
Application ProofASR MICROELECTRONICS CO., LTD.翱捷科技股份有限公司Fabless semiconductor company designing wireless connectivity chips, smart device SoCs, and custom ASIC solutions with cellular baseband and AI computing capabilities, serving device, edge, and cloud applications globally. Ranked No. 1 globally in cellular connectivity chips by shipment with 37.8% market share in 2025, per Frost & Sullivan.
- 2026-08-31
ProspectusDesigns, develops, back-end manufactures and sells semiconductor memory products (memory wafers paired with controller chips) for consumer, enterprise and industrial applications under the FORESEE, Zilia and Lexar brands, without wafer fabrication. Ninth largest memory product enterprise worldwide and largest independent memory enterprise in China per CIC.
- 2026-08-24
Application ProofShanghai Eigencomm Technologies Co., Ltd.上海移芯通信科技股份有限公司Designs fabless cellular IoT chips enabling LTE/5G connectivity for devices such as smart meters, vehicles and industrial equipment, with Edge-AI and Open-CPU capabilities. Ranked third globally in the cellular IoT chip market with 3.9% share per F&S Report; primarily operates in Chinese Mainland, headquartered in Shanghai.
- 2026-08-17
ProspectusFabless IC designer offering memory, computing, and analog chips used in automotive electronics, industrial and medical applications, AIoT, and intelligent security devices, serving customers globally through partnerships with foundries and OSAT companies.
- 2026-07-28
Application ProofGiantec Semiconductor Corporation聚辰半导体股份有限公司Fabless designer of non-volatile memory chips, including SPD, EEPROM and NOR Flash, plus lens driver and NFC chips, serving AI infrastructure, automotive, industrial and consumer electronics customers globally. Per Frost & Sullivan, the world's third largest EEPROM supplier and second largest DDR5 SPD supplier by revenue in 2023-2025.
- 2026-07-20
Application ProofSilicon-Magic Semiconductor Technology (Hangzhou) Co., Ltd.芯迈半导体技术(杭州)股份有限公司Develops and sells power semiconductors, including power management ICs and power devices, using proprietary process technologies under a Virtual IDM model. Products serve automotive, telecom base stations, data centers including AI servers, industrial applications, and consumer electronics in China and globally.
- 2026-07-14
Application ProofShenzhen Vergiga Semiconductor Co., Ltd.深圳市威兆半导体股份有限公司Designs and sells power semiconductor devices, including WLCSP-packaged medium-and-low-voltage and high-voltage products, used in consumer electronics, automotive electronics and industrial applications, mainly in China; outsources most wafer fabrication and packaging while retaining some in-house processes.
- 2026-07-10
Application ProofXTX Technology Inc.芯天下技术股份有限公司Fabless provider in the Chinese Mainland developing, designing and selling code storage flash memory (1Mbit to 8Gbit) used in communications, consumer electronics, IoT, industrial, medical and automotive applications, also offering analog ICs and MCUs; ranked among over 20 global fabless code storage flash providers per CIC.
- 2026-07-06
Application ProofHubei Dinglong Co., Ltd.湖北鼎龙控股股份有限公司Provides upstream materials solutions for semiconductor industry in China, including CMP pads and slurries, semiconductor display materials, lithography materials, and advanced packaging materials; largest domestic CMP pads provider with 38.5% market share per Frost & Sullivan in 2025.
- 2026-07-03
Application ProofHOSIN Global Electronics Co., Ltd.深圳宏芯宇电子股份有限公司Designs and sells memory products, including controller chip design and memory applications, serving consumer-grade customers such as smartphone and device makers including Xiaomi, Transsion, OPPO, Vivo and TCL in China. Per Frost & Sullivan, it is the world's fifth largest and China's second largest independent memory product enterprise by revenue in 2025.
- 2026-07-02
Application ProofLeading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd.礼鼎半导体科技（深圳）股份有限公司Designs, manufactures and sells IC substrates (FCBGA, FCCSP, WBCSP and module substrates) used in semiconductor packaging in Chinese Mainland. Ranked third among IC substrate manufacturers in Chinese Mainland by 2025 revenue, per Frost & Sullivan.
- 2026-06-30
ProspectusOperates a pure-play semiconductor foundry providing 12-inch wafer fabrication services, translating IC designs from fabless, fablite and IDM clients into processed wafers at nodes from 150nm to 40nm, serving display driver, CIS, PMIC, logic and MCU products.
- 2026-06-30
Application ProofLontium Semiconductor Corporation龙迅半导体（合肥）股份有限公司Fabless designer of high-speed mixed-signal chips, focusing on interconnect chips and smart video chips for smart terminals, vehicles, AR/VR devices and AI/HPC applications. Ranked number one fabless video bridging chip designer based in Chinese Mainland with 4.1% market share in 2025, per Frost & Sullivan.
- 2026-06-29
ProspectusDevelops, manufactures and sells silicon carbide (SiC) power devices, including SiC power modules, discrete devices and gate drivers, primarily for NEVs and also renewable energy, energy storage, industrial control, data centers and rail transport in China. Ranked sixth in China's SiC power module market in 2024 with 2.9% share, per Frost & Sullivan.
- 2026-06-26
Application ProofAllystar Technology (Shenzhen) Co., Ltd.深圳华大北斗科技股份有限公司Designs and sells GNSS chips, modules and positioning solutions supporting BeiDou, GPS and other satellite systems, plus third-party chip and module products, serving diverse positioning applications in China. Ranked fifth globally in dedicated GNSS chip/module shipments in 2025 with 7.4% share, per CIC.
- 2026-06-24
Revised APJIIOV Technology (Tianjin) Co., Ltd.极豪科技（天津）股份有限公司Provides AI-driven perceptual interaction solutions for smart devices, including proprietary chips with in-house algorithms supplied to module manufacturers for smartphone biometric recognition. Ranked second in China's smartphone biometric recognition solution market with 14.5% share in 2025, per Frost & Sullivan.
- 2026-06-23
PHIPGlorysoft (Shanghai) Co., Ltd.上海哥瑞利软件股份有限公司Provides intelligent manufacturing software solutions (IMSS) for the pan-semiconductor industry in China, integrating with complex semiconductor manufacturing processes. Ranked third in China's pan-semiconductor IMSS market with ~12% share in 2025, and second among domestic providers, per Frost & Sullivan.
- 2026-06-17
ProspectusManufactures and sells PCB direct imaging equipment and semiconductor direct-writing lithography equipment, with R&D, sales and maintenance services, to customers worldwide. Largest global PCB direct imaging equipment provider with 18.8% revenue share in 2025, and fourth in direct-writing lithography with 9.4%, per CIC.
- 2026-06-17
ProspectusDesigns and sells analog integrated circuits and sensors used in industrial, networking, consumer electronics, EVs, data centers and renewable energy applications in China. Ranked first among domestic and eighth among global companies in the China analog IC market by 2025 revenue, per Frost & Sullivan.
- 2026-06-09
ProspectusDesigns wireless sensor SoC chips, primarily for automotive applications such as intelligent tire sensing, with expansion into energy storage, industrial electronics, robotics and consumer electronics. Per F&S, ranked third globally and first in China in automotive wireless sensor SoC revenue in 2025.
- 2026-06-08
Application ProofQunce Technology Co., Ltd.苏州群策科技股份有限公司Develops, manufactures and sells IC substrates for advanced IC packaging, used in AI servers, data centres, smart devices, automotive electronics and industrial control. Per Frost & Sullivan, it was the second largest IC substrate company in the Chinese Mainland in 2025 by revenue, and largest in FCBGA and FCCSP substrates.
- 2026-06-05
Application ProofShenzhen CVA Innovation Co., Ltd.深圳曦华科技股份有限公司Designs edge AI chip products, including AI Scaler display chips, STDI chips, TMCUs, MCUs, touch ICs and smart cockpit control units, sold to automotive OEMs via Tier 1 suppliers and consumer electronics brands globally. Per F&S, developed the world's first ASIC-based AI Scaler.
- 2026-05-29
Application ProofShanghai GoNa Semiconductor Technology Co., Ltd.上海果纳半导体技术股份有限公司Develops, manufactures and sells wafer transfer equipment (EFEMs, sorters) and automated material handling systems for front-end semiconductor equipment makers and wafer foundries in China, also supplying packaging automation equipment and technical services. Ranked second among domestic companies in China's intelligent semiconductor transfer system market in 2025, per F&S.
- 2026-05-29
Application ProofZhejiang Zentel Memory Technology Co., Ltd.浙江力积存储科技股份有限公司Fabless designer and seller of niche DRAM chips, including DDR4 and older-generation memory products, sold as chips, modules and wafers; over 100 million chips sold in 2025. Ranked 12th globally in niche DRAM revenue in 2025 and fifth among Chinese companies, per Frost & Sullivan.
- 2026-05-29
Application ProofUnion Semiconductor (Hefei) Co., Ltd.合肥新汇成微电子股份有限公司Provides semiconductor packaging and testing services focused on DDICs, using bumping, CP, COG and COF technologies, serving LCD/AMOLED display customers in China. Fourth-largest DDIC advanced packaging and testing provider globally, second in the Chinese mainland, per Frost & Sullivan.
- 2026-05-18
ProspectusFabless designer of AMOLED display driver ICs (DDICs) for smartphones and Micro-OLED display drivers for VR/AR devices, sold to consumer electronics brand companies. Ranks fifth-largest and largest mainland China-based supplier in the global smartphone AMOLED DDIC market by 2024 sales volume, per Frost & Sullivan.
- 2026-05-12
Application ProofBIWIN STORAGE TECHNOLOGY CO., LTD.深圳佰维存储科技股份有限公司Designs and manufactures semiconductor memory solutions, including NAND Flash, DRAM and MCP products, and provides advanced packaging and testing services, sourcing NAND and DRAM wafers from vendors and foundries; serves mobile, PC, server, automotive and edge AI device applications.
- 2026-05-08
Application ProofJiangsu Silicon Integrity Semiconductor Technology Co., Ltd.江苏芯德半导体科技股份有限公司Provides semiconductor assembly and testing solutions, including packaging design, customized packaging products (QFN, BGA, LGA, WLP, 2.5D/3D) and packaging testing services, with a Chiplet and advanced packaging integration platform; operates in China since 2020.
- 2026-04-29
Application ProofShanghai Fullhan Microelectronics Co., Ltd.上海富瀚微电子股份有限公司Fabless designer of vision processing ICs for security cameras, video recorders and other vision devices in video, IoT and mobility applications in China, with chips integrating AI capabilities and bundled SDKs and algorithms.
- 2026-04-29
Application ProofShenzhen Intellifusion Technologies Co., Ltd.深圳云天励飞技术股份有限公司Designs and commercializes AI inference chips and NPU-powered chip-related products and services for enterprise, consumer, and industry applications in China, spanning AI inference infrastructure to deployment. Per CIC, a top three provider of full-scenario AI inference chip-related products and services in China by 2025 revenue.
- 2026-04-28
Application ProofWuhan Silicon Integrated Co., Ltd.武汉聚芯微电子股份有限公司Designs mixed-signal ICs with integrated sensing, machine vision, and imaging algorithms for smartphones, wearables, and tablets, and is expanding into robotics, digital twins, and automotive electronics; operates primarily in China's consumer electronics supply chain.
- 2026-04-28
Application ProofShenzhen Chuangzhi Semi-link Technology Co., Ltd.深圳创智芯联科技股份有限公司Manufactures and sells metallization and interconnection plating chemicals and provides plating services in China, serving wafer-level and chip-level semiconductor packaging and PCB assembly. Has operated in China's electronic packaging supply chain for nearly 20 years.
- 2026-04-20
Application ProofWuhan DR Laser Technology Corp., Ltd武汉帝尔激光科技股份有限公司Develops and manufactures laser-based precision micro- and nano-processing equipment, primarily laser machining systems for photovoltaic cell and module production, and is expanding into semiconductor advanced packaging and next-generation display applications such as Micro LED.
- 2026-04-12
Application ProofAmlogic (Shanghai) Co., Ltd.晶晨半导体（上海）股份有限公司Designs system-level SoCs for smart devices, including smart multimedia and display SoCs, AIoT SoCs, connectivity ICs, and smart automotive SoCs, serving smart home, office, mobility, entertainment, and industrial applications globally. Ranked fourth globally in smart device SoC revenue in 2024 per Frost & Sullivan.
- 2026-04-10
Application ProofBoffotto Semiconductor Co., Ltd.珠海宝丰堂半导体股份有限公司Manufactures and sells plasma processing equipment, including PCB plasma desmear equipment and semiconductor dry ashing, dry etching, and descum equipment, plus components and repair services, serving customers in Chinese Mainland, Southeast Asia, North America, and Europe. Ranks among China's top three in PCB plasma desmear equipment (2023-2025) with ~3.6% share in China's PCB plasma processing equipment market in 2025, per Frost & Sullivan.
- 2026-04-02
Application ProofSuzhou UIGreen Micro&Nano Technologies Co., Ltd.苏州和林微纳科技股份有限公司Designs and manufactures MEMS micro- and nanofabrication components, semiconductor test probes, and miniature transmission systems for the semiconductor and advanced manufacturing industries globally. Ranked second globally in MEMS acoustic module components with 12.4% market share in 2025, per Frost & Sullivan.
- 2026-04-01
Application ProofVeriSilicon Microelectronics (Shanghai) Co., Ltd.芯原微电子（上海）股份有限公司Provides custom silicon solutions and semiconductor IP licensing under a Silicon Platform as a Service model, serving global customers designing SoC and SiP chips. Headquartered in Shanghai; per CIC, ranked second-largest global digital-IP-focused semiconductor IP provider by IP revenue in 2025.
- 2026-03-31
Application ProofRayson HI-TECH(SZ) Co., Ltd.深圳市晶存科技股份有限公司Fabless designer and seller of embedded memory products (DRAM- and NAND Flash-based, MCP) and other memory products such as SSDs and DIMMs, procuring wafers externally and integrating its own controller chips, serving electronics device makers in Chinese Mainland.
- 2026-03-31
Application ProofAlkaidsemi (Shanghai) Technologies Corporation瑶芯微（上海）电子科技股份有限公司Designs power devices and audio ICs under a virtual IDM model, serving automotive, consumer electronics, energy and industrial, and AI data center power supply markets in China; per CIC, the only Chinese semiconductor company using this model for these products.
- 2026-03-30
Application ProofCHINA MICRO SEMICON (SHENZHEN) LIMITED中微半导体（深圳）股份有限公司Designs MCU-based integrated circuit chips, SoCs and ASICs, providing intelligent control solutions with embedded algorithms and technical support for consumer electronics, household appliances, industrial control and automotive applications in China. Ranked first in China's MCU industry by shipment volume in 2024, per Frost & Sullivan.
- 2026-03-29
Application ProofJoinsilicon Microelectronics (Beijing) Co., Ltd.中茵微电子(北京)股份有限公司Provides chip customization services in China, focusing on R&D and commercialization of AI ASICs using its IC technology platform and proprietary high-speed interface IPs. Ranked third among domestic chip customization providers by AI ASIC revenue in 2025, and second by chip design and delivery revenue, per CIC.
- 2026-03-27
Application ProofSigmaStar Technology Ltd.星宸科技股份有限公司Fabless designer and supplier of vision AI SoCs with integrated NPUs for edge visual processing, deployed in smart security, AIoT and smart automotive devices globally. Describes itself as a globally leading vision AI SoC design house.
- 2026-03-25
Application ProofYUANJIE SEMICONDUCTOR TECHNOLOGY CO., LTD.陕西源杰半导体科技股份有限公司Designs and manufactures laser chips, including CW, EML and DFB lasers, used in AI data centers, 5G infrastructure and fiber access networks. Ranked sixth largest global laser chip provider and second largest for SiPh-based high-speed optical interconnects by 2025 revenue, per CIC.
- 2026-03-23
ProspectusDesigns power amplifier audio chips and haptic drivers under a fabless model, serving consumer electronics and intelligent vehicle applications in China. Ranked fourth globally in power amplifier audio chips and fifth in haptic drivers in China by 2024 revenue, per F&S.
- 2026-03-20
ProspectusDevelops, mass produces and sells SiC epitaxial wafers used by customers to make power devices for EVs, charging infrastructure, renewable energy and energy storage, serving customers in China through Turnkey and Consign business models.
- 2026-03-13
ProspectusDesigns MCU and BMS chips, and produces artificial graphite anode materials and graphitization processing services for lithium-ion batteries, serving customers in China.
- 2026-01-30
ProspectusFabless designer of memory interface and interconnect chips (DDR2-DDR5, SPD, TS, PMIC, PCIe/CXL) for data centers, servers and PCs, serving global customers; world's largest memory interconnect chip supplier with 36.8% 2024 revenue share per Frost & Sullivan.
- 2026-01-30
ProspectusDesigns AI inference SoCs under a fabless model, using its NPU and AI-ISP technologies to provide perception and computing platforms for edge and endpoint AI applications, including smart vehicles, primarily in China.
- 2025-12-31
ProspectusFabless IC design house in Chinese Mainland offering Flash, niche DRAM, MCU, analog and sensor chips for consumer electronics, automotive, industrial, PC/server, IoT and networking applications, with outsourced manufacturing. Per Frost & Sullivan, a prominent specialty memory chip and MCU company in Chinese Mainland.
- 2025-12-31
ProspectusFabless designer of CMOS image sensors and semiconductor solutions for smartphones, automobiles, medical, surveillance, machine vision and edge AI applications worldwide; the third largest digital image sensor provider globally with 13.7% revenue market share in 2024, per Frost & Sullivan.
- 2025-12-30
ProspectusDesigns GPGPU chips and accelerators and provides AI computing solutions, including GPGPU servers and clusters with a proprietary software stack for AI training and inference, serving customers across diverse industries in China.
- 2025-12-22
ProspectusDevelops GPGPU chips and GPGPU-based intelligent computing solutions combining self-developed hardware with the proprietary BIRENSUPA software platform, supporting AI model training and inference from cloud to edge for customers across industries in China.
- 2025-11-28
ProspectusFabless designer of analog chips, offering sensor products, signal chain chips and power management chips for automotive electronics, energy and industrial automation, and consumer electronics, primarily in China. Ranked 14th in the 2024 Chinese analog chip market with 0.9% revenue share, and fifth among Chinese analog chip companies, per Frost & Sullivan.
- 2025-11-27
ProspectusManufactures silicon carbide (SiC) epitaxial wafers, key raw materials for power semiconductor devices, sold to device makers; third largest China-based SiC epitaxial wafer manufacturer globally in 2024 with 6.7% revenue share, and largest in the PRC market with 30.6% revenue share (per Frost & Sullivan-type prospectus ranking).
- 2025-08-11
ProspectusDevelops and mass-produces silicon carbide (SiC) substrates, semiconductor materials supplied to global semiconductor companies for use in EVs, AI data centers, photovoltaics, power grids and telecommunications; a top-three global SiC substrate maker with 16.7% market share in 2024, per Frost & Sullivan.
- 2025-06-30
ProspectusDesigns BLDC motor control and driver ICs, including motor control chips (MCUs, ASICs), driver chips (HVICs), IPMs and power devices (MOSFETs), serving motor control system applications in China; ranked a leading BLDC motor control chip provider per Frost & Sullivan.
- 2024-12-18
ProspectusDevelops and mass-produces GaN-on-Silicon power semiconductor wafers and devices across a full voltage spectrum, serving power electronics applications globally. Ranked first globally among GaN power semiconductor companies by 2023 revenue, with 0.2% of the global power semiconductor market, per Frost & Sullivan.
- 2024-07-31
ProspectusDesigns automotive-grade computing SoCs and SoC-based intelligent vehicle solutions, including autonomous driving, smart cockpit and gateway products, sold as Tier 2 supplier to the automotive industry in China and globally. Third largest global provider of automotive-grade high-computing power SoCs by 2023 shipments, per Frost & Sullivan.
- 2024-06-21
ProspectusProvides precision machining and precision welding services for international companies, primarily serving the semiconductor sector, and also aerospace and data center customers. Headquartered in Singapore, it ranked fifth in the semiconductor segment of Singapore's precision component engineering industry in 2023 with about 3.3% market share, per CIC.
- 2024-05-24
ProspectusManufactures back-end semiconductor transport media, including engineering-plastics trays and carrier tapes used to store and protect semiconductor components during production and delivery, and provides MEMS and sensor packaging. Ranked third globally in tray-related products in 2023 with about 8.4% market share, per F&S.
- 2023-12-18
ProspectusProvides analog IC patterned wafers with completed built-on circuits in China, which downstream customers package and test into individual IC chips; also offers packaging and testing solutions. Largest provider in China with a 1.7% market share of the RMB21.3 billion market in 2022, per Frost & Sullivan.