HOSIN Electronics Co., LTD.
深圳宏芯宇电子股份有限公司
02681.HK
Develops and sells memory products, including embedded storage, SSDs, DRAM, mobile storage and memory ICs, with wafer fabrication and packaging outsourced to third parties, serving smartphone, PC, server, data-center and automotive customers globally. Ranked 12th in the global memory market with 0.6% revenue share in 2025, per Frost & Sullivan.
Filings
The documents are on HKEXnews; we link to the originals.
| 2026-10-30 | Prospectus | HKEXnews | |
| 2026-10-20 | PHIP | PHIP (1st submission) | HKEXnews |
| 2026-07-03 | Application Proof | Application Proof (1st submission) | HKEXnews |
Key figures
Latest period: 4M2026 (to 2026-04-30). As printed in the filing; the full track record is in the company overview.
- Revenue
- RMB8,012.3 million
- Gross margin
- 62.0%
- Net profit (loss)
- RMB3,840.6 million
Matters the filing discloses
From the company’s latest filing; open a kind of matter to see how other companies disclosed it.
- Failure to register and file one lease agreement
- Customers made payments for goods through third-party payers
- Hefei Hechu was included on the US Entity List
- Customs penalty for export of integrated circuits infringing trademark rights
- Revenue from the five largest customers accounted for between 40.8% and 65.7%
- Proportion of purchases from the five largest suppliers increased to 63.0%
- Several of the five largest customers and suppliers are counterparties to one another
- Supplier D among the five largest suppliers is not an independent third party
- Decrease in the number of distributors while distribution revenue increased
- Time lag in the linkage between product pricing and memory wafer prices
- Overseas revenue accounted for over 60%, with Hong Kong as the principal delivery hub
- Customer-supplied materials arrangement with Customer G accounted for over 70% of embedded storage sales volume
- Return to profitability after a net loss of RMB117.5 million in 2023
- Substantial increase in prepayments to RMB3,680 million
- Significant increase in inventories and turnover days rose to 356 days
- Impairment had been made against goodwill and patent assets
- Transfer pricing arrangements for intra-group cross-border transactions
Other applicants in the same industry
All of them: Semiconductors
Provides semiconductor assembly and testing services, including packaging design, customized packaging products (QFN, BGA, LGA, WLP, 2.5D/3D) and packaging testing. Established in 2020; per Frost & Sullivan, advanced packaging is a key performance driver in the post-Moore era.
Develops and sells general-purpose GPU chips for enterprise AI computing in China, based on its proprietary GPU+ (Minsky) architecture, and provides scenario-optimized computing platforms and solutions. Was the third largest player in China's enterprise AI GPGPU market with 1.0% share in 2025, per Frost & Sullivan.
- Shenzhen Chuangzhi Semi-link Technology Co., Ltd.深圳创智芯联科技股份有限公司
Manufactures and sells plating chemicals for electroless plating and electroplating, including ENIG/ENEPIG, copper and gold electroplating chemicals, serving the semiconductor packaging and PCB industries in China. Ranked first among Chinese manufacturers in these markets per Frost & Sullivan.
- Anhui Sinomags Technology Co., Ltd安徽希磁科技股份有限公司
Designs and manufactures magnetic sensors under an IDM model spanning chip design, wafer fabrication (in China and Germany) and module manufacturing, serving green energy, automotive, industrial automation, robotics and data center customers. Ranked tenth globally in magnetic sensor revenue in 2025 with 0.6% market share, per Frost & Sullivan.
Fabless RISC-V chip designer in China offering chip, chipset and circuit board products with integrated software, serving 220 customers worldwide in human-machine interaction, multimedia processing, interconnectivity and computing. Largest domestic smart device human-machine interaction chip product provider by revenue in 2025, per Frost & Sullivan.
Provides manufacturing equipment and systems for the photovoltaic industry, including PV cell production automation equipment, complete production lines, and MES-based intelligent manufacturing systems, and, via subsidiary ficonTEC, assembly and testing equipment for silicon photonics devices globally.
- ASR MICROELECTRONICS CO., LTD.翱捷科技股份有限公司
Fabless semiconductor company designing wireless connectivity chips, smart device SoCs, and custom ASIC solutions with cellular baseband and AI computing capabilities, serving device, edge, and cloud applications globally. Ranked No. 1 globally in cellular connectivity chips by shipment with 37.8% market share in 2025, per Frost & Sullivan.
Designs, develops, back-end manufactures and sells semiconductor memory products (memory wafers paired with controller chips) for consumer, enterprise and industrial applications under the FORESEE, Zilia and Lexar brands, without wafer fabrication. Ninth largest memory product enterprise worldwide and largest independent memory enterprise in China per CIC.