Jiangsu Xinde Semiconductor Technology Co., Ltd.
江苏芯德半导体科技股份有限公司
07672.HK
Provides semiconductor assembly and testing services, including packaging design, customized packaging products (QFN, BGA, LGA, WLP, 2.5D/3D) and packaging testing. Established in 2020; per Frost & Sullivan, advanced packaging is a key performance driver in the post-Moore era.
Filings
The documents are on HKEXnews; we link to the originals.
| 2026-10-30 | Prospectus | HKEXnews | |
| 2026-10-21 | PHIP | PHIP (1st submission) | HKEXnews |
| 2026-05-08 | Re-filed AP | Application Proof (1st submission) | HKEXnews |
Key figures
Latest period: 4M2026 (to 2026-04-30). As printed in the filing; the full track record is in the company overview.
- Revenue
- RMB359.7 million
- Gross margin
- -17.9%
- Net profit (loss)
- RMB-161.9 million
Matters the filing discloses
From the company’s latest filing; open a kind of matter to see how other companies disclosed it.
- Six lease agreements were not registered and filed
- Lessor of leased properties had not obtained property ownership certificates
- Underpayment of social insurance and housing provident fund
- Two administrative penalties for pollutant exceedances in 2023
- Seven patent ownership dispute cases
- Litigation over a dispute concerning an energy management contract with Dongwang Changli
- Provision of loans and advances to related parties
- Revenue from the five largest customers accounted for over 50% during the Track Record Period
- Purchases from the five largest suppliers accounted for approximately 30% to 35%
- One of the five largest customers is also a supplier and one of the five largest suppliers is a customer
- Entry into a two-year cooperation framework agreement with optical module Customer Q
- Underutilisation of production capacity while the Yangzhou facility remains in the ramp-up stage
- Net losses incurred in each period throughout the Track Record Period
- Impairment test of non-current assets of the Nanjing cash generating unit
- Interest on redemption liabilities arising from redemption rights of Pre-IPO Investors
- Bank wealth management products held measured at fair value
- Adjusted net loss and adjusted EBITDA, non-IFRS measures
- Fluctuations in government grants led to significant fluctuations in other income and gains
- Transactions with customers and suppliers on the US Entity List
- The company is a covered foreign person under the US outbound investment rules
- Decline in customer retention rate in the first four months of 2026
Other applicants in the same industry
All of them: Semiconductors
Develops and sells memory products, including embedded storage, SSDs, DRAM, mobile storage and memory ICs, with wafer fabrication and packaging outsourced to third parties, serving smartphone, PC, server, data-center and automotive customers globally. Ranked 12th in the global memory market with 0.6% revenue share in 2025, per Frost & Sullivan.
Develops and sells general-purpose GPU chips for enterprise AI computing in China, based on its proprietary GPU+ (Minsky) architecture, and provides scenario-optimized computing platforms and solutions. Was the third largest player in China's enterprise AI GPGPU market with 1.0% share in 2025, per Frost & Sullivan.
- Shenzhen Chuangzhi Semi-link Technology Co., Ltd.深圳创智芯联科技股份有限公司
Manufactures and sells plating chemicals for electroless plating and electroplating, including ENIG/ENEPIG, copper and gold electroplating chemicals, serving the semiconductor packaging and PCB industries in China. Ranked first among Chinese manufacturers in these markets per Frost & Sullivan.
- Anhui Sinomags Technology Co., Ltd安徽希磁科技股份有限公司
Designs and manufactures magnetic sensors under an IDM model spanning chip design, wafer fabrication (in China and Germany) and module manufacturing, serving green energy, automotive, industrial automation, robotics and data center customers. Ranked tenth globally in magnetic sensor revenue in 2025 with 0.6% market share, per Frost & Sullivan.
Fabless RISC-V chip designer in China offering chip, chipset and circuit board products with integrated software, serving 220 customers worldwide in human-machine interaction, multimedia processing, interconnectivity and computing. Largest domestic smart device human-machine interaction chip product provider by revenue in 2025, per Frost & Sullivan.
Provides manufacturing equipment and systems for the photovoltaic industry, including PV cell production automation equipment, complete production lines, and MES-based intelligent manufacturing systems, and, via subsidiary ficonTEC, assembly and testing equipment for silicon photonics devices globally.
- ASR MICROELECTRONICS CO., LTD.翱捷科技股份有限公司
Fabless semiconductor company designing wireless connectivity chips, smart device SoCs, and custom ASIC solutions with cellular baseband and AI computing capabilities, serving device, edge, and cloud applications globally. Ranked No. 1 globally in cellular connectivity chips by shipment with 37.8% market share in 2025, per Frost & Sullivan.
Designs, develops, back-end manufactures and sells semiconductor memory products (memory wafers paired with controller chips) for consumer, enterprise and industrial applications under the FORESEE, Zilia and Lexar brands, without wafer fabrication. Ninth largest memory product enterprise worldwide and largest independent memory enterprise in China per CIC.