Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd.

礼鼎半导体科技（深圳）股份有限公司

Designs, manufactures and sells IC substrates (FCBGA, FCCSP, WBCSP and module substrates) used in semiconductor packaging in Chinese Mainland. Ranked third among IC substrate manufacturers in Chinese Mainland by 2025 revenue, per Frost & Sullivan.

Filings

The documents are on HKEXnews; we link to the originals.

Matters the filing discloses

From the company’s latest filing; open a kind of matter to see how other companies disclosed it.

• Customer concentration
• Supplier concentration
• Overlapping customers and suppliers
• Raw material and commodity prices
• Outsourced production (OEM / contract manufacturing)
• Overseas markets and operations
• Particular sales arrangements
• Capacity and utilisation
• Reliance on the controlling shareholder
• Losses and path to profitability
• Working capital: receivables, prepayments and cash cycle
• Inventory level and ageing
• Transfer pricing
• Related-party transactions and balances
• Sanctioned countries and export controls